Global Head of Embedded Electronics Engineering

LOCATION:

India, US or EU - Remote

COMPENSATION & PERFORMANCE INCENTIVE:

Compensation for this role is competitive and will be commensurate with experience, domain expertise, and geographic location.

The compensation package includes:

• Base Salary: Determined based on location, years of experience, and demonstrated P&L leadership.
• Performance-Based Bonus: Significant annual incentive opportunity tied directly to:
• • Revenue growth within the Manufacturing Engineering vertical
  • Gross margin expansion
  • Overall business performance and strategic growth milestones

This role is designed for a business builder. Incentive earnings increase meaningfully with vertical revenue growth and sustained margin performance.

BENEFITS:

Benefits are competitive and vary by country and local market requirements. Comprehensive benefits packages may include:

• Health, dental, and vision coverage (where applicable)
• Retirement contributions
• Paid time off and holidays in accordance with local standards
• Life and disability insurance (location dependent)
• Professional development and leadership growth opportunities
• Travel reimbursement and business-related expenses

Specific benefit details will be shared during the interview process based on the candidate’s work location.

JOB DESCRIPTION/TYPICAL TASK BREAKDOWN:

We are seeking a highly experienced Global Head of Embedded Engineering to lead the strategy, growth, and global delivery of embedded systems and advanced electronics engineering services.

This executive leadership role owns the full P&L of the Embedded Engineering vertical and will lead global teams delivering complex hardware and software systems for connected products, industrial electronics, and advanced embedded platforms.

The ideal candidate will combine deep technical expertise in embedded systems with strong leadership and commercial experience to scale global engineering operations and expand strategic customer partnerships.

DUTIES & RESPONSIBILITIES:

Strategic Leadership

• Define the global strategy for embedded systems engineering services
• Expand embedded hardware, firmware, and software capabilities
• Drive innovation in connected products and advanced electronics

Full P&L Responsibility

• Own revenue growth, margin performance, and operational efficiency
• Manage budgeting, forecasting, and financial performance

Global Customer Leadership

• Develop executive relationships with international customers
• Lead proposals, pricing discussions, and commercial negotiations
• Support customer product development programs

Global Delivery Management

• Lead global embedded engineering teams
• Ensure high-quality delivery of hardware and firmware programs
• Establish scalable development and validation frameworks

Technical Leadership

Provide subject matter leadership across:

• Embedded hardware architecture
• Firmware development and real-time systems
• Embedded Linux and RTOS environments
• Electronics design and validation
• System integration and product development

Travel

·  Domestic and international travel is required to support customers and global teams.

EDUCATION & EXPERIENCE:

· Master’s degree+ in Embedded Systems Engineering, Electrical Engineering, Electronics Engineering, Computer Engineering, or related field.

·  15–20 years of experience in one or more of the following industries (mandatory):

o   Heavy engineering

o   Earth moving equipment

o   Automotive

o   Industrial equipment

·  Leadership Competencies:

o   Strategic thinker with entrepreneurial mindset

o   Strong commercial acumen

o   Excellent communication and stakeholder management skills

o   Ability to operate in a global matrix organization

o   High emotional intelligence and cultural awareness

·        Proven experience managing large, multi-location engineering teams

·        Significant international customer interaction experience

·        Demonstrated P&L or revenue responsibility

·        Strong executive presence and leadership maturity

REQUIRED TECHNICAL SKILLS:

·        Deep expertise in Embedded Electronics Engineering

·        Embedded hardware design (analog/digital, PCB design, power management)

·        Microcontrollers, SoCs, RTOS, Linux-based systems

·        Firmware architecture and C/C++ development

·        Communication protocols (CAN, SPI, I2C, Ethernet, BLE, Wi-Fi, etc.)

·        Knowledge of global embedded electronics standards and compliance

Required Systems & Digital Embedded Knowledge 

• ERP systems (SAP, Oracle, or equivalent)
• PLM systems (Teamcenter, Windchill, or similar)
• Advanced Excel & data-driven decision making
• KPI dashboards and performance analytics
• Embedded C/C++ best practices
• Memory management in constrained systems
• Bootloaders and secure startup sequences
• Board Support Package (BSP) architecture
• Driver development
• Middleware integration
• Over-the-air update architectures

DESIRED SKILLS:

·        Advanced System Architecture Expertise

·        High-Performance Digital & Processing Systems

·        Functional Safety & Compliance Leadership

·        Embedded Cybersecurity Expertise

·        Digital Engineering & Automation

·        Connectivity & Edge Integration

·        Reliability & Robustness Engineering

·        Innovation & Emerging Technology Acumen

·        Technical Due Diligence & Executive Advisory Capability

We are committed to building a diverse, inclusive, and global team. Candidates must be authorized to work in the United States. We are pleased to offer visa sponsorship for eligible and qualified individuals.

Cintal provides equal employment opportunities to all employees and applicants for employment without regard to race, color, creed, ancestry, national origin, citizenship, sex or gender (including pregnancy, childbirth, and pregnancy-related conditions), gender identity or expression (including transgender status), sexual orientation, marital status, religion, age, disability, genetic information, service in the military, or any other characteristic protected by applicable federal, state, or local laws and ordinances. Equal employment opportunities apply to all terms and conditions of employment, including hiring, placement, promotion, termination, layoff, recall, transfer, leave of absence, compensation, and training.