Lead Product Manager, AI Storage Solutions

ESSENTIAL DUTIES AND RESPONSIBILITIES:

As a Lead Product Manager, AI Storage Solutions you will define the strategic vision, roadmap, and execution plan for next‑generation memory solutions that enable cutting‑edge AI, Machine Learning, and High‑Performance Computing ecosystems. You will serve as the connective tissue across engineering, marketing, operations, and hyperscale customers—driving competitive differentiation and business growth for high‑performance memory products.

Key Responsibilities
Strategic Product Leadership
Own the multi‑year product roadmap, aligning with technology inflection points such as AI Storage Solutions, and emerging AI Storage Solutions architectures. Translate market dynamics, customer signals, and competitive insights into product requirements (MRD/PRD).

Customer & Market Engagement
Lead deep technical engagements with hyperscalers and chipmakers (e.g., NVIDIA, AMD), turning customer performance, latency, and capacity needs into engineering deliverables.
Position product solutions for AI inference, KV‑cache, and memory‑centric architectures informed by industry trends, inference context memory, KV‑tiering.

Business & Financial Ownership
Build business cases including TAM/SAM/SOM models, pricing strategies, investment requirements, and ROI modeling. Guide lifecycle execution from concept → development → through cross‑functional program reviews (Stage Gate).

Execution & Cross‑Functional Leadership
Partner closely with ASIC, firmware, NAND, system, and quality teams to drive technical readiness and performance targets. Manage supplier relationships and work with supply chain to ensure cost, yield, and delivery success. Coordinate internal alignment with engineering, reliability, operations, and exec staff.

Competitive Intelligence
Maintain a robust understanding of the semiconductor memory landscape—AI Storage Solutions competition, NAND‑AI Storage Solutions, emerging AI architectures, and customer platform roadmaps.

Technical Expertise
Strong understanding of:
3D stacking / TSV
Memory–accelerator integration (AI/ML GPU pipelines)
Memory subsystem architecture and performance analysis
AI Storage Solutions, NAND‑based high‑bandwidth architectures