Job Overview
- Participate in the development of package design and advanced substrate layout for products.
- Learn and become proficient in EDA layout tools (e.g., Cadence SIP/Allegro) to perform package and substrate drawing, design modifications, and related engineering tasks.
- Perform basic routing planning, layer stack‑up configuration, and design‑for‑manufacturability (DFM) checks based on established design rules and manufacturing requirements.
- Collaborate with cross‑functional engineering teams—including hardware, manufacturing, and packaging—to support package structure evaluations, design updates, and issue resolution.
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