Principal Engineer, Hardware Development Engineering

ESSENTIAL DUTIES AND RESPONSIBILITIES:

1. To sustain the magnetoresistive (TMR sensor) film deposition operation and characterize the TMR sensor film magnetic properties, such as TMR film blocking temperature, magnetic moment, pinning field and crystal structures by VSM, TEM and XRF/XRR.
2. Responsible to analyze the wafer processing and probing results. To correlate the wafer probing results to wafer individual processing steps and materials to create action items and recommendations to resolve the production yield and quality issues.
3. To perform and/or coordinate wafer level F/A activities related to TMR deposition processes, such as TEM analysis, wafer level SPC audit to identify possible root causes for all released products.
4. Work with advanced reader sensor stack development group to transfer new reader sensor deposition processes into production.